- All sections
- B - Performing operationstransporting
- B22F - Working metallic powdermanufacture of articles from metallic powdermaking metallic powderapparatus or devices specially adapted for metallic powder
- B22F 1/07 - Metallic powder characterised by particles having a nanoscale microstructure
Patent holdings for IPC class B22F 1/07
Total number of patents in this class: 136
10-year publication summary
|
1
|
4
|
6
|
11
|
30
|
17
|
27
|
12
|
14
|
11
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Dowa Electronics Materials Co., Ltd. | 635 |
9 |
| TDK Corporation | 6927 |
6 |
| HRL Laboratories, LLC | 1628 |
4 |
| Seoul National University R&db Foundation | 4224 |
4 |
| Honda Motor Co., Ltd. | 26154 |
3 |
| Kyocera Corporation | 14433 |
3 |
| Massachusetts Institute of Technology | 10285 |
3 |
| University of Florida Research Foundation, Inc. | 4196 |
3 |
| Northwestern University | 3564 |
3 |
| Alpha Assembly Solutions Inc. | 211 |
3 |
| JFE Steel Corporation | 7599 |
3 |
| Tanaka Kikinzoku Kogyo K.K. | 574 |
3 |
| UT-Battelle, LLC | 1519 |
3 |
| Seiko Epson Corporation | 20365 |
2 |
| Murata Manufacturing Co., Ltd. | 25847 |
2 |
| Commissariat à l'énergie atomique et aux energies alternatives | 11124 |
2 |
| Korea Institute of Science and Technology | 2253 |
2 |
| Formosa Plastics Corporation | 64 |
2 |
| The Industry & Academic Cooperation in Chungnam National University (IAC) | 519 |
2 |
| Plasmology4, Inc. | 47 |
2 |
| Other owners | 72 |