- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/018 - UnsolderingRemoval of melted solder or other residues
Patent holdings for IPC class B23K 1/018
Total number of patents in this class: 93
10-year publication summary
|
15
|
14
|
5
|
5
|
6
|
8
|
3
|
7
|
6
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| International Business Machines Corporation | 62111 |
7 |
| Illinois Tool Works Inc. | 11712 |
5 |
| Flextronics AP, LLC | 443 |
5 |
| Greene Lyon Group, Inc. | 19 |
5 |
| Hakko Corporation | 118 |
5 |
| Samsung Electronics Co., Ltd. | 152716 |
4 |
| Micron Technology, Inc. | 27243 |
3 |
| Tanigurogumi Corporation | 9 |
3 |
| PulseForge Incorporated | 55 |
3 |
| Siemens AG | 24299 |
2 |
| Alstom Technology Ltd | 1067 |
2 |
| Hamilton Sundstrand Corporation | 5013 |
2 |
| Schaeffler Technologies AG & Co. KG | 10629 |
2 |
| Antaya Technologies Corporation | 32 |
2 |
| ERSA GmbH | 98 |
2 |
| Newsouth Innovations Pty Limited | 613 |
2 |
| PAC Tech - Packaging Technologies GmbH | 99 |
2 |
| LTG Green-Tech R&D Company Limited | 4 |
2 |
| The Boeing Company | 20113 |
1 |
| Infineon Technologies AG | 8360 |
1 |
| Other owners | 33 |