- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/08 - Soldering by means of dipping in molten solder
Patent holdings for IPC class B23K 1/08
Total number of patents in this class: 217
10-year publication summary
|
21
|
9
|
21
|
21
|
17
|
7
|
15
|
12
|
6
|
7
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 679 |
42 |
| Illinois Tool Works Inc. | 11450 |
22 |
| Mitsubishi Electric Corporation | 45946 |
14 |
| ERSA GmbH | 97 |
14 |
| Omron Corporation | 7251 |
6 |
| Fuji Corporation | 3344 |
6 |
| Pillarhouse International Limited | 8 |
6 |
| Abbott Cardiovascular Systems, Inc. | 1114 |
5 |
| Alpha Assembly Solutions Inc. | 200 |
5 |
| Flex Ltd. | 219 |
5 |
| International Business Machines Corporation | 61185 |
4 |
| Panasonic Corporation | 20142 |
4 |
| Fujitsu Ten Limited | 457 |
4 |
| Nordson Corporation | 1199 |
4 |
| Linde Aktiengesellschaft | 1517 |
3 |
| Tanigurogumi Corporation | 9 |
3 |
| Robert Bosch GmbH | 42614 |
2 |
| Tyco Electronics (shanghai) Co. Ltd. | 879 |
2 |
| Fuji Machine Mfg. Co., Ltd. | 979 |
2 |
| Goertek Inc. | 2653 |
2 |
| Other owners | 62 |