- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 1/08 - Soldering by means of dipping in molten solder
Patent holdings for IPC class B23K 1/08
Total number of patents in this class: 225
10-year publication summary
|
9
|
21
|
21
|
17
|
7
|
15
|
12
|
7
|
14
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Senju Metal Industry Co., Ltd. | 690 |
41 |
| Illinois Tool Works Inc. | 11863 |
29 |
| ERSA GmbH | 59 |
15 |
| Mitsubishi Electric Corporation | 48236 |
14 |
| Abbott Cardiovascular Systems, Inc. | 1015 |
6 |
| Omron Corporation | 7402 |
6 |
| Fuji Corporation | 3668 |
6 |
| Alpha Assembly Solutions Inc. | 211 |
5 |
| Flex Ltd. | 210 |
5 |
| Pillarhouse International Limited | 8 |
5 |
| International Business Machines Corporation | 62754 |
4 |
| Panasonic Corporation | 18809 |
4 |
| Nordson Corporation | 1206 |
4 |
| Fujitsu Ten Limited | 437 |
3 |
| Robert Bosch GmbH | 44252 |
3 |
| Linde Aktiengesellschaft | 1416 |
3 |
| Tanigurogumi Corporation | 12 |
3 |
| Tyco Electronics (shanghai) Co. Ltd. | 1073 |
2 |
| Fuji Machine Mfg. Co., Ltd. | 979 |
2 |
| Goertek Inc. | 2837 |
2 |
| Other owners | 63 |