- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/03 - Observing, e.g. monitoring, the workpiece
Patent holdings for IPC class B23K 26/03
Total number of patents in this class: 2326
10-year publication summary
|
143
|
208
|
193
|
239
|
251
|
225
|
246
|
225
|
222
|
153
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Disco Corporation | 1869 |
90 |
| Precitec GmbH & Co. KG | 196 |
90 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
61 |
| Hamamatsu Photonics K.K. | 4446 |
58 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 542 |
56 |
| FANUC Corporation | 6758 |
46 |
| IPG Photonics Corporation | 539 |
43 |
| TRUMPF Werkzeugmaschinen SE + Co. KG | 252 |
37 |
| General Electric Company | 13845 |
36 |
| Seurat Technologies, Inc. | 160 |
36 |
| Panasonic Intellectual Property Management Co., Ltd. | 31806 |
35 |
| Bystronic Laser AG | 270 |
32 |
| Nikon Corporation | 7213 |
31 |
| Mitsubishi Electric Corporation | 46397 |
27 |
| Toyota Motor Corporation | 32788 |
25 |
| Divergent Technologies, Inc. | 477 |
22 |
| Glowforge Inc. | 83 |
20 |
| nLIGHT, Inc. | 412 |
20 |
| Concept Laser GmbH | 190 |
20 |
| Siemens AG | 24409 |
19 |
| Other owners | 1522 |