- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/04 - Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
Patent holdings for IPC class B23K 26/04
Total number of patents in this class: 981
10-year publication summary
|
59
|
75
|
81
|
83
|
63
|
63
|
50
|
49
|
34
|
10
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Hamamatsu Photonics K.K. | 4382 |
48 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 552 |
35 |
| Electro Scientific Industries, Inc. | 380 |
31 |
| Precitec GmbH & Co. KG | 195 |
31 |
| FANUC Corporation | 6581 |
26 |
| Disco Corporation | 1848 |
25 |
| TRUMPF Laser- und Systemtechnik GmbH | 532 |
21 |
| Mitsubishi Electric Corporation | 45752 |
20 |
| Velo3D, Inc. | 153 |
20 |
| IPG Photonics Corporation | 520 |
14 |
| Corning Incorporated | 10232 |
13 |
| Bystronic Laser AG | 270 |
13 |
| Precitec Optronik GmbH | 73 |
12 |
| Semiconductor Energy Laboratory Co., Ltd. | 11353 |
11 |
| Amada Company, Limited | 553 |
10 |
| Scansonic MI GmbH | 37 |
10 |
| Precitec KG | 23 |
9 |
| Siemens AG | 24568 |
8 |
| Nikon Corporation | 7155 |
8 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6124 |
8 |
| Other owners | 608 |