- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/042 - Automatically aligning the laser beam
Patent holdings for IPC class B23K 26/042
Total number of patents in this class: 260
10-year publication summary
|
18
|
18
|
27
|
31
|
27
|
26
|
22
|
24
|
20
|
25
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Panasonic Intellectual Property Management Co., Ltd. | 34724 |
11 |
| General Electric Company | 14036 |
8 |
| Mitsubishi Electric Corporation | 48546 |
8 |
| FANUC Corporation | 7465 |
8 |
| Lawrence Livermore National Security, LLC | 1987 |
6 |
| IPG Photonics Corporation | 601 |
6 |
| Nikon Corporation | 7227 |
5 |
| Hamamatsu Photonics K.K. | 4739 |
5 |
| Disco Corporation | 1965 |
5 |
| Robert Bosch GmbH | 44445 |
4 |
| Bystronic Laser AG | 274 |
4 |
| KEYENCE Corporation | 550 |
4 |
| Precitec GmbH & Co. KG | 205 |
4 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
4 |
| Laservall Technology Co., Ltd | 13 |
4 |
| Illinois Tool Works Inc. | 11925 |
3 |
| The Furukawa Electric Co., Ltd. | 3729 |
3 |
| Makino Milling Machine Co., Ltd. | 433 |
3 |
| nLIGHT, Inc. | 420 |
3 |
| Tokyo Seimitsu Co., Ltd. | 444 |
3 |
| Other owners | 159 |