- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/067 - Dividing the beam into multiple beams, e.g. multi-focusing
Patent holdings for IPC class B23K 26/067
Total number of patents in this class: 980
10-year publication summary
|
57
|
79
|
85
|
60
|
77
|
88
|
93
|
86
|
82
|
24
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Laser- und Systemtechnik GmbH | 531 |
65 |
| Hamamatsu Photonics K.K. | 4595 |
42 |
| Disco Corporation | 1929 |
39 |
| The Furukawa Electric Co., Ltd. | 3700 |
25 |
| Samsung Display Co., Ltd. | 37753 |
21 |
| EO Technics Co., Ltd. | 111 |
20 |
| Panasonic Intellectual Property Management Co., Ltd. | 33462 |
16 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6105 |
16 |
| Corning Incorporated | 10420 |
15 |
| Electro Scientific Industries, Inc. | 363 |
14 |
| nLIGHT, Inc. | 412 |
14 |
| 4JET Microtech GmbH | 53 |
13 |
| IPG Photonics Corporation | 576 |
12 |
| Robert Bosch GmbH | 43554 |
11 |
| Nikon Corporation | 7310 |
11 |
| Industrial Technology Research Institute | 5079 |
10 |
| General Electric Company | 13819 |
9 |
| TRUMPF Laser GmbH | 158 |
9 |
| Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. | 5173 |
8 |
| TRUMPF Laser SE | 51 |
8 |
| Other owners | 602 |