- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/067 - Dividing the beam into multiple beams, e.g. multi-focusing
Patent holdings for IPC class B23K 26/067
Total number of patents in this class: 998
10-year publication summary
|
60
|
82
|
88
|
62
|
78
|
89
|
96
|
86
|
85
|
44
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
65 |
| Hamamatsu Photonics K.K. | 4681 |
46 |
| Disco Corporation | 1956 |
39 |
| The Furukawa Electric Co., Ltd. | 3694 |
25 |
| Samsung Display Co., Ltd. | 38627 |
21 |
| EO Technics Co., Ltd. | 114 |
20 |
| Panasonic Intellectual Property Management Co., Ltd. | 33997 |
16 |
| Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | 6117 |
16 |
| Corning Incorporated | 10504 |
15 |
| Electro Scientific Industries, Inc. | 345 |
14 |
| nLIGHT, Inc. | 417 |
14 |
| Nikon Corporation | 7228 |
13 |
| IPG Photonics Corporation | 585 |
12 |
| 4JET Microtech GmbH | 53 |
12 |
| Robert Bosch GmbH | 44160 |
11 |
| Industrial Technology Research Institute | 5209 |
11 |
| General Electric Company | 13899 |
10 |
| TRUMPF Laser GmbH | 158 |
9 |
| Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V. | 5257 |
8 |
| TRUMPF Laser SE | 70 |
8 |
| Other owners | 613 |