- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/16 - Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
Patent holdings for IPC class B23K 26/16
Total number of patents in this class: 718
10-year publication summary
|
51
|
61
|
61
|
37
|
56
|
54
|
69
|
58
|
59
|
45
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Seurat Technologies, Inc. | 175 |
35 |
| LG Energy Solution, Ltd. | 18906 |
33 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 520 |
13 |
| Samsung Display Co., Ltd. | 38627 |
12 |
| Disco Corporation | 1956 |
12 |
| Hamamatsu Photonics K.K. | 4681 |
11 |
| Velo3D, Inc. | 149 |
11 |
| Honda Motor Co., Ltd. | 26025 |
10 |
| TOYOKOH, Co., Ltd. | 28 |
10 |
| Yamazaki Mazak Corporation | 264 |
9 |
| Mitsubishi Electric Corporation | 48018 |
8 |
| The Boeing Company | 20160 |
7 |
| Tokyo Electron Limited | 13807 |
7 |
| Amada Company, Limited | 621 |
7 |
| Contemporary Amperex Technology Co., Limited | 9961 |
7 |
| Nippon Steel Corporation | 6871 |
7 |
| POSCO | 2143 |
7 |
| Panasonic Intellectual Property Management Co., Ltd. | 33997 |
6 |
| Bystronic Laser AG | 278 |
6 |
| IPG Photonics Corporation | 585 |
6 |
| Other owners | 494 |