- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/38 - Removing material by boring or cutting
Patent holdings for IPC class B23K 26/38
Total number of patents in this class: 3486
10-year publication summary
|
248
|
218
|
285
|
320
|
290
|
290
|
267
|
266
|
257
|
174
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 548 |
151 |
| Bystronic Laser AG | 271 |
97 |
| TRUMPF Werkzeugmaschinen SE + Co. KG | 235 |
88 |
| Disco Corporation | 1852 |
85 |
| Hamamatsu Photonics K.K. | 4405 |
82 |
| Amada Holdings Co., Ltd. | 280 |
71 |
| Amada Company, Limited | 558 |
68 |
| Corning Incorporated | 10252 |
66 |
| Mitsubishi Electric Corporation | 45962 |
54 |
| Samsung Display Co., Ltd. | 34539 |
49 |
| Asahi Glass Company, Limited | 2799 |
38 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
38 |
| Electro Scientific Industries, Inc. | 375 |
32 |
| FANUC Corporation | 6636 |
32 |
| Nippon Electric Glass Co., Ltd. | 2454 |
31 |
| Precitec GmbH & Co. KG | 196 |
29 |
| IPG Photonics Corporation | 527 |
25 |
| LG Energy Solution, Ltd. | 14807 |
25 |
| Mitsubishi Heavy Industries, Ltd. | 8694 |
24 |
| Nitto Denko Corporation | 8217 |
24 |
| Other owners | 2377 |