- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/38 - Removing material by boring or cutting
Patent holdings for IPC class B23K 26/38
Total number of patents in this class: 3759
10-year publication summary
|
218
|
285
|
322
|
290
|
291
|
270
|
274
|
259
|
296
|
194
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 516 |
146 |
| TRUMPF Werkzeugmaschinen SE + Co. KG | 334 |
124 |
| Bystronic Laser AG | 276 |
108 |
| Disco Corporation | 1960 |
88 |
| Hamamatsu Photonics K.K. | 4713 |
74 |
| Amada Holdings Co., Ltd. | 266 |
71 |
| Amada Company, Limited | 627 |
70 |
| Corning Incorporated | 10538 |
61 |
| Samsung Display Co., Ltd. | 39087 |
56 |
| Mitsubishi Electric Corporation | 48351 |
54 |
| Asahi Glass Company, Limited | 2597 |
38 |
| FANUC Corporation | 7369 |
38 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
38 |
| LG Energy Solution, Ltd. | 19461 |
38 |
| Precitec GmbH & Co. KG | 204 |
33 |
| Electro Scientific Industries, Inc. | 345 |
31 |
| Nippon Electric Glass Co., Ltd. | 2567 |
31 |
| ADIGE S.p.A. | 54 |
26 |
| Hypertherm, Inc. | 679 |
26 |
| IPG Photonics Corporation | 594 |
25 |
| Other owners | 2583 |