- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/384 - Removing material by boring or cutting by boring of specially shaped holes
Patent holdings for IPC class B23K 26/384
Total number of patents in this class: 136
10-year publication summary
|
28
|
24
|
15
|
22
|
12
|
11
|
12
|
12
|
10
|
9
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Corning Incorporated | 10240 |
9 |
| Siemens AG | 24547 |
4 |
| Omron Corporation | 7238 |
4 |
| CoreSyte, Inc. | 13 |
4 |
| Disco Corporation | 1848 |
4 |
| Siemens Energy Global GmbH & Co. KG | 2923 |
4 |
| Rtx Corporation | 9313 |
4 |
| Samsung Display Co., Ltd. | 34290 |
3 |
| Airbus S.A.S. | 897 |
3 |
| SCHOTT AG | 1709 |
3 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 552 |
3 |
| TensorX, Inc. | 13 |
3 |
| Jsw Aktina System, Co., Ltd. | 71 |
3 |
| General Electric Company | 13830 |
2 |
| International Business Machines Corporation | 61123 |
2 |
| Mitsubishi Heavy Industries, Ltd. | 8657 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 31022 |
2 |
| Haute Ecole ARC | 16 |
2 |
| Serenity Data Security, LLC | 11 |
2 |
| Taiwan Green Point Enterprises Co., Ltd. | 51 |
2 |
| Other owners | 71 |