- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/384 - Removing material by boring or cutting by boring of specially shaped holes
Patent holdings for IPC class B23K 26/384
Total number of patents in this class: 128
10-year publication summary
|
28
|
24
|
15
|
22
|
12
|
11
|
11
|
12
|
9
|
3
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Corning Incorporated | 10125 |
9 |
| Siemens AG | 24565 |
4 |
| Omron Corporation | 7156 |
4 |
| CoreSyte, Inc. | 13 |
4 |
| Disco Corporation | 1815 |
4 |
| Siemens Energy Global GmbH & Co. KG | 2829 |
4 |
| Rtx Corporation | 9109 |
4 |
| Samsung Display Co., Ltd. | 32798 |
3 |
| Airbus S.A.S. | 855 |
3 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 560 |
3 |
| TensorX, Inc. | 13 |
3 |
| Jsw Aktina System, Co., Ltd. | 68 |
3 |
| General Electric Company | 17789 |
2 |
| International Business Machines Corporation | 60129 |
2 |
| Mitsubishi Heavy Industries, Ltd. | 8538 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 29733 |
2 |
| Haute Ecole ARC | 16 |
2 |
| Serenity Data Security, LLC | 11 |
2 |
| Taiwan Green Point Enterprises Co., Ltd. | 52 |
2 |
| Joongwoo M-tech Co., Ltd. | 9 |
2 |
| Other owners | 64 |