- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/53 - Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Patent holdings for IPC class B23K 26/53
Total number of patents in this class: 1171
10-year publication summary
|
66
|
108
|
124
|
144
|
170
|
145
|
132
|
105
|
91
|
78
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Hamamatsu Photonics K.K. | 4446 |
191 |
| Disco Corporation | 1869 |
153 |
| Corning Incorporated | 10300 |
112 |
| Tokyo Electron Limited | 12877 |
58 |
| Siltectra GmbH | 88 |
43 |
| SCHOTT AG | 1712 |
42 |
| TRUMPF Laser- und Systemtechnik GmbH | 533 |
39 |
| Lintec Corporation | 1968 |
27 |
| Agc, Inc. | 4913 |
17 |
| Nichia Corporation | 3735 |
14 |
| Tokyo Seimitsu Co., Ltd. | 346 |
14 |
| Samsung Electronics Co., Ltd. | 147501 |
13 |
| Hoya Corporation | 2753 |
12 |
| Nippon Electric Glass Co., Ltd. | 2468 |
12 |
| Nippon Sheet Glass Company, Limited | 984 |
10 |
| LPKF Laser & Electronics AG | 91 |
9 |
| National University Corporation Saitama University | 129 |
9 |
| Denso Corporation | 24431 |
8 |
| Rohm Co., Ltd. | 6480 |
8 |
| Semiconductor Components Industries, L.L.C. | 5269 |
8 |
| Other owners | 372 |