- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/70 - Auxiliary operations or equipment
Patent holdings for IPC class B23K 26/70
Total number of patents in this class: 2236
10-year publication summary
|
247
|
211
|
227
|
219
|
241
|
207
|
223
|
244
|
245
|
127
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| FANUC Corporation | 7155 |
58 |
| Disco Corporation | 1953 |
42 |
| Precitec GmbH & Co. KG | 202 |
41 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 523 |
40 |
| Bystronic Laser AG | 277 |
38 |
| TRUMPF Werkzeugmaschinen SE + Co. KG | 317 |
38 |
| Panasonic Intellectual Property Management Co., Ltd. | 33834 |
36 |
| Seurat Technologies, Inc. | 172 |
36 |
| Contemporary Amperex Technology Co., Limited | 9544 |
35 |
| Velo3D, Inc. | 149 |
30 |
| Illinois Tool Works Inc. | 11841 |
28 |
| Mitsubishi Electric Corporation | 47852 |
28 |
| General Electric Company | 13863 |
23 |
| IPG Photonics Corporation | 579 |
23 |
| Makeblock Co., Ltd. | 244 |
23 |
| Samsung Display Co., Ltd. | 38352 |
22 |
| Nikon Corporation | 7259 |
19 |
| Amada Company, Limited | 619 |
19 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
19 |
| Amada Holdings Co., Ltd. | 267 |
17 |
| Other owners | 1621 |