- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/70 - Auxiliary operations or equipment
Patent holdings for IPC class B23K 26/70
Total number of patents in this class: 2256
10-year publication summary
|
247
|
211
|
227
|
219
|
241
|
207
|
223
|
244
|
245
|
147
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| FANUC Corporation | 7249 |
58 |
| Disco Corporation | 1958 |
42 |
| Precitec GmbH & Co. KG | 201 |
40 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 518 |
40 |
| Bystronic Laser AG | 278 |
38 |
| TRUMPF Werkzeugmaschinen SE + Co. KG | 323 |
38 |
| Panasonic Intellectual Property Management Co., Ltd. | 34080 |
36 |
| Contemporary Amperex Technology Co., Limited | 10065 |
36 |
| Seurat Technologies, Inc. | 175 |
35 |
| Velo3D, Inc. | 152 |
30 |
| Illinois Tool Works Inc. | 11864 |
28 |
| Mitsubishi Electric Corporation | 48097 |
28 |
| Makeblock Co., Ltd. | 259 |
25 |
| IPG Photonics Corporation | 588 |
24 |
| General Electric Company | 13908 |
23 |
| Samsung Display Co., Ltd. | 38721 |
23 |
| Amada Company, Limited | 624 |
20 |
| Nikon Corporation | 7232 |
19 |
| TRUMPF Laser- und Systemtechnik GmbH | 524 |
19 |
| Yamazaki Mazak Corporation | 267 |
19 |
| Other owners | 1635 |