- All sections
- B - Performing operationstransporting
- B23K - Soldering or unsolderingweldingcladding or plating by soldering or weldingcutting by applying heat locally, e.g. flame cuttingworking by laser beam
- B23K 26/70 - Auxiliary operations or equipment
Patent holdings for IPC class B23K 26/70
Total number of patents in this class: 1997
10-year publication summary
121
|
247
|
211
|
227
|
219
|
241
|
206
|
222
|
237
|
149
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
FANUC Corporation | 6640 |
53 |
Disco Corporation | 1851 |
40 |
TRUMPF Werkzeugmaschinen GmbH + Co. KG | 548 |
40 |
Precitec GmbH & Co. KG | 196 |
38 |
Bystronic Laser AG | 271 |
35 |
Panasonic Intellectual Property Management Co., Ltd. | 31273 |
34 |
Seurat Technologies, Inc. | 159 |
34 |
Velo3D, Inc. | 153 |
30 |
Mitsubishi Electric Corporation | 45998 |
26 |
Illinois Tool Works Inc. | 11453 |
24 |
Contemporary Amperex Technology Co., Limited | 6522 |
24 |
General Electric Company | 13762 |
23 |
Samsung Display Co., Ltd. | 34595 |
20 |
Amada Company, Limited | 560 |
20 |
TRUMPF Laser- und Systemtechnik GmbH | 533 |
19 |
Nikon Corporation | 7159 |
18 |
Amada Holdings Co., Ltd. | 280 |
17 |
IPG Photonics Corporation | 529 |
17 |
Rtx Corporation | 9352 |
17 |
GE Infrastructure Technology, LLC | 6213 |
16 |
Other owners | 1452 |