- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 35/34 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
Patent holdings for IPC class B23K 35/34
Total number of patents in this class: 111
10-year publication summary
|
5
|
7
|
4
|
4
|
2
|
1
|
1
|
3
|
4
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Lincoln Global, Inc. | 2160 |
7 |
| Alfa Laval Corporate AB | 1305 |
6 |
| Hobart Brothers LLC | 106 |
5 |
| Consolidated Nuclear Security, LLC | 125 |
4 |
| Heraeus Deutschland GmbH & Co. KG | 437 |
4 |
| Hobart Brothers Company | 99 |
4 |
| Electronics and Telecommunications Research Institute | 9003 |
3 |
| Hubbell Incorporated | 3162 |
3 |
| Nippon Welding Rod Co., Ltd. | 6 |
3 |
| Senju Metal Industry Co., Ltd. | 676 |
3 |
| Heraeus Electronics GmbH & Co. KG | 76 |
3 |
| The Boeing Company | 19901 |
2 |
| Mitsubishi Heavy Industries, Ltd. | 8515 |
2 |
| Siemens Energy, Inc. | 1734 |
2 |
| The Johns Hopkins University | 5524 |
2 |
| Applied Nanoparticle Laboratory Corporation | 19 |
2 |
| Harima Chemicals, Inc. | 204 |
2 |
| Heraeus Materials Technology GmbH & Co. KG | 28 |
2 |
| Koki Company Limited | 69 |
2 |
| Nihon Handa Co., Ltd. | 18 |
2 |
| Other owners | 48 |