- All sections
- B - Performing operationstransporting
- B26D - Cuttingdetails common to machines for perforating, punching, cutting-out, stamping-out or severing
- B26D 1/04 - Cutting through work characterised by the nature or movement of the cutting memberApparatus or machines thereforCutting members therefor involving a cutting member which does not travel with the work having a linearly-movable cutting member
Patent holdings for IPC class B26D 1/04
Total number of patents in this class: 258
10-year publication summary
|
16
|
28
|
27
|
19
|
29
|
28
|
24
|
28
|
24
|
23
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| LG Energy Solution, Ltd. | 19856 |
10 |
| Canon Inc. | 44585 |
5 |
| Cricut, Inc. | 195 |
5 |
| Cutting Edge Packaging Solutions, LLC | 20 |
5 |
| Samsung SDI Co., Ltd. | 11033 |
4 |
| Mimaki Engineering Co., Ltd. | 949 |
4 |
| VMI Holland B.V. | 454 |
4 |
| Canon Kabushiki Kaisha | 7417 |
4 |
| Ricoh Company, Ltd. | 13421 |
3 |
| Brother Industries, Ltd. | 12862 |
3 |
| Monsanto Technology LLC | 8583 |
3 |
| Disco Corporation | 1965 |
3 |
| Pirelli Tyre S.p.A. | 1970 |
3 |
| 3m Innovative Properties Company | 17455 |
2 |
| Samsung Display Co., Ltd. | 39307 |
2 |
| Hewlett-Packard Development Company, L.P. | 25103 |
2 |
| Seiko Epson Corporation | 20554 |
2 |
| Semiconductor Energy Laboratory Co., Ltd. | 11922 |
2 |
| Casio Computer Co., Ltd. | 3519 |
2 |
| Dow Global Technologies LLC | 11090 |
2 |
| Other owners | 188 |