- All sections
- B - Performing operationstransporting
- B26F - Perforatingpunchingcutting-outstamping-outsevering by means other than cutting
- B26F 3/16 - Severing by using heat by radiation
Patent holdings for IPC class B26F 3/16
Total number of patents in this class: 25
10-year publication summary
|
3
|
2
|
2
|
3
|
3
|
2
|
0
|
0
|
0
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| W.R.R. Holding Leiden B.V. | 12 |
3 |
| Tecna S.p.A. | 25 |
2 |
| Hewlett-Packard Development Company, L.P. | 25342 |
1 |
| Koninklijke Philips N.V. | 25624 |
1 |
| 3D-Micromac AG | 51 |
1 |
| Babcock & Wilcox Technical Services Y-12, LLC | 22 |
1 |
| Bundesdruckerei GmbH | 990 |
1 |
| CeramTec AG | 45 |
1 |
| Frisimos, Ltd. | 16 |
1 |
| Japan Agency for Marine-Earth Science and Technology | 172 |
1 |
| Laserax Inc. | 16 |
1 |
| Nippon Electric Glass Co., Ltd. | 2512 |
1 |
| Silicon Genesis Corporation | 32 |
1 |
| Spinnova Oy | 22 |
1 |
| Taiyo Yuden Co., Ltd. | 2016 |
1 |
| Tannpapier GmbH | 58 |
1 |
| Telwin S.p.A. | 17 |
1 |
| TRUMPF Werkzeugmaschinen GmbH + Co. KG | 531 |
1 |
| University of Washington | 2407 |
1 |
| HEGLA GmbH & Co. KG | 22 |
1 |
| Other owners | 2 |