- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 115/02 - Rubber derivatives containing halogen
Patent holdings for IPC class C09J 115/02
Total number of patents in this class: 30
10-year publication summary
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0
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3
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1
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4
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3
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2
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0
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2
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3
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1
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| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| DDP Specialty Electronic Materials US, LLC | 846 |
4 |
| Sika Technology AG | 2928 |
3 |
| Amrize Technology Switzerland LLC | 679 |
3 |
| 3m Innovative Properties Company | 17614 |
2 |
| National Institute of Advanced Industrial Science and Technology | 3800 |
2 |
| Holcim Technology Ltd. | 497 |
2 |
| Lord Corporation | 466 |
2 |
| Valqua, Ltd. | 292 |
2 |
| Rohm and Haas Company | 2943 |
1 |
| Arlanxeo Deutschland GmbH | 276 |
1 |
| Denka Company Limited | 2676 |
1 |
| Unimatec Co., Ltd. | 235 |
1 |
| DDP Specialty Electronic Materials US Inc | 55 |
1 |
| BARDALES MENDOZA, Enrique Rosendo | 3 |
1 |
| Jiangsu Langyue New Materials Technology Co., Ltd. | 10 |
1 |
| Shandong Huida Rubber Co., Ltd | 1 |
1 |
| Resonac Corporation | 3083 |
1 |
| Otsuka Material Science and Technology (Shanghai) Co., Ltd. | 3 |
1 |
| Other owners | 0 |