- All sections
- C - Chemistry; metallurgy
- C09J - Adhesives; non-mechanical aspects of adhesive processes in general; adhesive processes not provided for elsewhere; use of materials as adhesives
- C09J 133/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
Patent holdings for IPC class C09J 133/14
Total number of patents in this class: 806
10-year publication summary
|
87
|
58
|
57
|
70
|
56
|
60
|
54
|
52
|
57
|
6
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Nitto Denko Corporation | 8085 |
83 |
| 3m Innovative Properties Company | 17951 |
68 |
| LG Chem, Ltd. | 17637 |
38 |
| Henkel AG & Co. KGaA | 10343 |
38 |
| Lintec Corporation | 1937 |
33 |
| Soken Chemical & Engineering Co., Ltd. | 256 |
25 |
| BASF SE | 20403 |
17 |
| Sekisui Chemical Co., Ltd. | 3307 |
17 |
| Avery Dennison Corporation | 1229 |
16 |
| Samsung Display Co., Ltd. | 32745 |
13 |
| Samsung SDI Co., Ltd. | 7318 |
12 |
| Tesa SE | 1028 |
12 |
| Oji Holdings Corporation | 701 |
10 |
| Mitsubishi Chemical Corporation | 4446 |
9 |
| Kaneka Corporation | 4497 |
9 |
| Resonac Corporation | 2414 |
9 |
| Hitachi Chemical Company, Ltd. | 2387 |
8 |
| Bostik SA | 633 |
8 |
| DIC Corporation | 3663 |
8 |
| Teraoka Seisakusho Co., Ltd. | 97 |
8 |
| Other owners | 365 |