- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
Patent holdings for IPC class C09J 183/08
Total number of patents in this class: 179
10-year publication summary
|
15
|
11
|
11
|
14
|
20
|
11
|
16
|
10
|
9
|
4
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Lintec Corporation | 2008 |
17 |
| Shin-Etsu Chemical Co., Ltd. | 6083 |
15 |
| Henkel AG & Co. KGaA | 10770 |
14 |
| 3m Innovative Properties Company | 17488 |
12 |
| Sika Technology AG | 3002 |
12 |
| Momentive Performance Materials Inc. | 901 |
6 |
| Dow Silicones Corporation | 2109 |
6 |
| Bostik SA | 677 |
5 |
| Evonik Operations GmbH | 4336 |
4 |
| Citibank, N.A., AS Administrative Agent | 245 |
3 |
| Henkel IP & Holding GmbH | 559 |
3 |
| Swiss Krono Tec AG | 512 |
3 |
| Dow Toray Co., Ltd. | 620 |
3 |
| DDP Specialty Electronic Materials US, LLC | 850 |
3 |
| Solventum Intellectual Properties Company | 3415 |
3 |
| PRC-DeSoto International, Inc. | 568 |
2 |
| Toray Industries, Inc. | 7096 |
2 |
| Dow Corning Corporation | 879 |
2 |
| Dow Corning Toray Co., Ltd. | 456 |
2 |
| Kagoshima University | 327 |
2 |
| Other owners | 60 |