- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 183/08 - Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
Patent holdings for IPC class C09J 183/08
Total number of patents in this class: 173
10-year publication summary
|
19
|
15
|
11
|
11
|
14
|
19
|
12
|
12
|
10
|
2
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Lintec Corporation | 1939 |
17 |
| Henkel AG & Co. KGaA | 10367 |
16 |
| 3m Innovative Properties Company | 17998 |
14 |
| Shin-Etsu Chemical Co., Ltd. | 5479 |
14 |
| Sika Technology AG | 2862 |
11 |
| Momentive Performance Materials Inc. | 906 |
7 |
| Dow Silicones Corporation | 1817 |
5 |
| Bostik SA | 637 |
4 |
| Evonik Operations GmbH | 4036 |
4 |
| Citibank, N.A., AS Administrative Agent | 276 |
3 |
| Henkel IP & Holding GmbH | 576 |
3 |
| Swiss Krono Tec AG | 484 |
3 |
| Dow Toray Co., Ltd. | 541 |
3 |
| DDP Specialty Electronic Materials US, LLC | 766 |
3 |
| Solventum Intellectual Properties Company | 3323 |
3 |
| PRC-DeSoto International, Inc. | 578 |
2 |
| Toray Industries, Inc. | 6864 |
2 |
| Dow Corning Corporation | 1012 |
2 |
| Dow Corning Toray Co., Ltd. | 527 |
2 |
| Kagoshima University | 305 |
2 |
| Other owners | 53 |