- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 187/00 - Adhesives based on unspecified macromolecular compounds, obtained otherwise than by polymerisation reactions only involving unsaturated carbon-to-carbon-bonds
Patent holdings for IPC class C09J 187/00
Total number of patents in this class: 30
10-year publication summary
|
3
|
1
|
4
|
3
|
1
|
1
|
2
|
4
|
4
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| 3m Innovative Properties Company | 17600 |
2 |
| Contemporary Amperex Technology Co., Limited | 8650 |
2 |
| EPG (engineered Nanoproducts Germany) AG | 40 |
2 |
| SHPP Global Technologies B.V. | 1092 |
2 |
| International Business Machines Corporation | 62002 |
1 |
| Intel Corporation | 46594 |
1 |
| Mitsubishi Rayon Co., Ltd. | 880 |
1 |
| Mitsubishi Chemical Corporation | 4682 |
1 |
| The Furukawa Electric Co., Ltd. | 3710 |
1 |
| Arkema France | 4168 |
1 |
| Auto Chemical Industry Co., Ltd. | 6 |
1 |
| Bank of America, N.A. | 300 |
1 |
| Bostik SA | 660 |
1 |
| Kabushiki Kaisha Toyota Chuo Kenkyusho | 641 |
1 |
| Lord Corporation | 467 |
1 |
| Nihon Parkerizing Co., Ltd. | 293 |
1 |
| Tesa SE | 1089 |
1 |
| Threebond Co., Ltd. | 139 |
1 |
| Threebond Fine Chemical Co., Ltd. | 22 |
1 |
| Tokyo Ohka Kogyo Co., Ltd. | 1549 |
1 |
| Other owners | 6 |