- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 4/00 - Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond
Patent holdings for IPC class C09J 4/00
Total number of patents in this class: 1453
10-year publication summary
|
131
|
127
|
100
|
88
|
107
|
89
|
92
|
79
|
81
|
65
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| 3m Innovative Properties Company | 17730 |
104 |
| Henkel AG & Co. KGaA | 10654 |
92 |
| Nitto Denko Corporation | 8355 |
63 |
| LG Chem, Ltd. | 17679 |
54 |
| Hitachi Chemical Company, Ltd. | 2317 |
52 |
| Sekisui Chemical Co., Ltd. | 3493 |
40 |
| Dexerials Corporation | 1959 |
34 |
| Lintec Corporation | 1993 |
32 |
| Henkel IP & Holding GmbH | 561 |
29 |
| Toagosei Co., Ltd. | 977 |
26 |
| FUJIFILM Corporation | 29817 |
23 |
| BASF SE | 21087 |
22 |
| Bostik SA | 657 |
21 |
| Samsung Display Co., Ltd. | 36265 |
17 |
| Avery Dennison Corporation | 1193 |
17 |
| Samsung SDI Co., Ltd. | 8878 |
15 |
| The Furukawa Electric Co., Ltd. | 3706 |
15 |
| Oji Holdings Corporation | 744 |
13 |
| Sika Technology AG | 2908 |
13 |
| CJ Cheiljedang Corporation | 3494 |
12 |
| Other owners | 759 |