- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 7/00 - Adhesives in the form of films or foils
Patent holdings for IPC class C09J 7/00
Total number of patents in this class: 1960
10-year publication summary
|
220
|
205
|
151
|
68
|
45
|
64
|
36
|
30
|
44
|
33
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Nitto Denko Corporation | 8645 |
191 |
| Lintec Corporation | 2042 |
124 |
| 3m Innovative Properties Company | 17463 |
111 |
| Dexerials Corporation | 2020 |
100 |
| LG Chem, Ltd. | 18005 |
86 |
| Hitachi Chemical Company, Ltd. | 2215 |
76 |
| Tesa SE | 1147 |
65 |
| Samsung Electronics Co., Ltd. | 159978 |
50 |
| Zeon Corporation | 4183 |
33 |
| Mitsubishi Chemical Corporation | 4774 |
27 |
| Samsung SDI Co., Ltd. | 11065 |
26 |
| FUJIFILM Corporation | 30866 |
25 |
| DIC Corporation | 4008 |
25 |
| Toray Industries, Inc. | 7164 |
18 |
| Avery Dennison Corporation | 1159 |
18 |
| Soken Chemical & Engineering Co., Ltd. | 263 |
18 |
| The Furukawa Electric Co., Ltd. | 3729 |
17 |
| Oji Holdings Corporation | 813 |
16 |
| Sekisui Chemical Co., Ltd. | 3671 |
16 |
| Sony Chemical & Information Device Corporation | 206 |
16 |
| Other owners | 902 |