- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 7/10 - Adhesives in the form of films or foils without carriers
Patent holdings for IPC class C09J 7/10
Total number of patents in this class: 866
10-year publication summary
|
17
|
41
|
89
|
113
|
107
|
120
|
127
|
114
|
76
|
67
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| 3m Innovative Properties Company | 17717 |
79 |
| Nitto Denko Corporation | 8361 |
76 |
| Tesa SE | 1072 |
49 |
| LG Chem, Ltd. | 17704 |
35 |
| Lintec Corporation | 1990 |
35 |
| Dexerials Corporation | 1960 |
31 |
| Samsung SDI Co., Ltd. | 8922 |
18 |
| Mitsubishi Chemical Corporation | 4608 |
18 |
| Sekisui Chemical Co., Ltd. | 3510 |
16 |
| Hangzhou First Applied Material Co., Ltd. | 39 |
15 |
| Samsung Electronics Co., Ltd. | 149362 |
13 |
| Lohmann GmbH & Co. KG | 94 |
12 |
| Henkel AG & Co. KGaA | 10655 |
11 |
| The Furukawa Electric Co., Ltd. | 3703 |
11 |
| Samsung Display Co., Ltd. | 36421 |
9 |
| Oji Holdings Corporation | 748 |
9 |
| Xinmei Fontana Holding (Hong Kong) Limited | 157 |
9 |
| Hitachi Chemical Company, Ltd. | 2315 |
7 |
| Shin-Etsu Chemical Co., Ltd. | 5807 |
7 |
| Dai Nippon Printing Co., Ltd. | 4150 |
7 |
| Other owners | 399 |