- All sections
- C - Chemistrymetallurgy
- C09J - Adhesivesnon-mechanical aspects of adhesive processes in generaladhesive processes not provided for elsewhereuse of materials as adhesives
- C09J 7/29 - Laminated material
Patent holdings for IPC class C09J 7/29
Total number of patents in this class: 1277
10-year publication summary
|
52
|
102
|
146
|
169
|
216
|
183
|
144
|
118
|
120
|
76
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| 3m Innovative Properties Company | 17478 |
100 |
| Nitto Denko Corporation | 8536 |
89 |
| Lintec Corporation | 2008 |
59 |
| Avery Dennison Corporation | 1163 |
38 |
| Tesa SE | 1128 |
29 |
| Sekisui Chemical Co., Ltd. | 3614 |
16 |
| Samsung Electronics Co., Ltd. | 157719 |
15 |
| LG Chem, Ltd. | 17921 |
13 |
| Dai Nippon Printing Co., Ltd. | 4238 |
13 |
| Denka Company Limited | 2720 |
12 |
| Shurtape Technologies, LLC | 394 |
12 |
| Toyobo Co., Ltd. | 2535 |
12 |
| FUJIFILM Corporation | 30514 |
10 |
| Huawei Technologies Co., Ltd. | 123385 |
10 |
| Mitsui Chemicals Tohcello, Inc. | 243 |
10 |
| Teraoka Seisakusho Co., Ltd. | 102 |
9 |
| Zagg Incorporated | 135 |
9 |
| Samsung Display Co., Ltd. | 38627 |
8 |
| Samsung SDI Co., Ltd. | 10589 |
8 |
| Dow Global Technologies LLC | 10944 |
8 |
| Other owners | 797 |