- All sections
- C - Chemistrymetallurgy
- C22C - Alloys
- C22C 1/047 - Making non-ferrous alloys by powder metallurgy comprising intermetallic compounds
Patent holdings for IPC class C22C 1/047
Total number of patents in this class: 35
10-year publication summary
0
|
0
|
1
|
0
|
4
|
6
|
0
|
5
|
13
|
1
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Materion Corporation | 303 |
5 |
Oerlikon Surface Solutions AG, Pfaffikon | 559 |
3 |
Elementum 3D, Inc. | 13 |
3 |
PLANSEE Composite Materials GmbH | 30 |
2 |
Terves, LLC | 54 |
2 |
Toshiba Corporation | 12076 |
1 |
Board of Regents, The University of Texas System | 5641 |
1 |
AB Sandvik Coromant | 215 |
1 |
City University of Hong Kong | 779 |
1 |
Consiglio Nazionale delle Ricerche | 547 |
1 |
Dowa Holdings Co., Ltd. | 73 |
1 |
Furuya Metal Co., Ltd. | 118 |
1 |
General Electric Technology GmbH | 1599 |
1 |
National Institute for Materials Science | 1101 |
1 |
PLANSEE SE | 234 |
1 |
SANYO Special Steel Co., Ltd. | 217 |
1 |
Toshiba Materials Co., Ltd. | 632 |
1 |
University of Maryland, College Park | 967 |
1 |
The University of Tokyo | 4070 |
1 |
PLANSEE (Shanghai) High Performance Material Ltd. | 7 |
1 |
Other owners | 5 |