- All sections
- C - Chemistrymetallurgy
- C25D - Processes for the electrolytic or electrophoretic production of coatingselectroformingjoining workpieces by electrolysisapparatus therefor
- C25D 3/64 - ElectroplatingBaths therefor from solutions of alloys containing more than 50% by weight of silver
Patent holdings for IPC class C25D 3/64
Total number of patents in this class: 83
10-year publication summary
|
1
|
7
|
4
|
3
|
12
|
8
|
4
|
3
|
5
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Umicore Galvanotechnik GmbH | 55 |
8 |
| Dowa Metaltech Co., Ltd. | 174 |
6 |
| BASF SE | 21303 |
4 |
| JX Nippon Mining & Metals Corporation | 1461 |
4 |
| Mitsubishi Materials Corporation | 2468 |
4 |
| DuPont Electronic Materials International, LLC | 426 |
4 |
| Xtalic Corporation | 68 |
3 |
| Tyco Electronics Corporation | 717 |
2 |
| HARTING AG & Co. KG | 18 |
2 |
| M-tech Japan Co., Ltd. | 3 |
2 |
| MacDermid Enthone Inc. | 248 |
2 |
| MSP Co., Ltd. | 8 |
2 |
| S&schem Co.,Ltd. | 2 |
2 |
| Eeja Ltd. | 16 |
2 |
| Rtx Corporation | 10082 |
2 |
| Shenzhen United Blue Ocean Applied Materials Technology Co., Ltd. | 6 |
2 |
| Sumitomo Electric Industries, Ltd. | 16305 |
1 |
| Robert Bosch GmbH | 44128 |
1 |
| Huawei Technologies Co., Ltd. | 123282 |
1 |
| Yazaki Corporation | 7097 |
1 |
| Other owners | 28 |