- All sections
- F - Mechanical engineeringlightingheatingweaponsblasting
- F28D - Heat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contactheat storage plants or apparatus in general
- F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
Patent holdings for IPC class F28D 15/02
Total number of patents in this class: 3126
10-year publication summary
261
|
313
|
314
|
370
|
377
|
272
|
272
|
232
|
213
|
97
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
The Furukawa Electric Co., Ltd. | 3650 |
131 |
Asia Vital Components Co., Ltd. | 407 |
90 |
Murata Manufacturing Co., Ltd. | 24526 |
88 |
Denso Corporation | 24282 |
84 |
NEC Corporation | 35652 |
64 |
Cooler Master Co., Ltd. | 227 |
48 |
Shinko Electric Industries Co., Ltd. | 1209 |
40 |
Fujitsu Limited | 18351 |
35 |
Microsoft Technology Licensing, LLC | 53720 |
34 |
Delta Electronics, Inc. | 2605 |
32 |
ABB Schweiz AG | 6969 |
32 |
Mitsubishi Electric Corporation | 46093 |
31 |
Dai Nippon Printing Co., Ltd. | 4082 |
31 |
Huawei Technologies Co., Ltd. | 112438 |
30 |
Nidec Corporation | 2662 |
28 |
Fujikura Ltd. | 2933 |
25 |
LG Electronics Inc. | 73021 |
24 |
International Business Machines Corporation | 61228 |
24 |
Intel Corporation | 46962 |
23 |
Samsung Electronics Co., Ltd. | 146092 |
21 |
Other owners | 2211 |