- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 1/18 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
Patent holdings for IPC class H01B 1/18
Total number of patents in this class: 161
10-year publication summary
|
12
|
12
|
7
|
13
|
16
|
17
|
7
|
10
|
5
|
5
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Nexeon Limited | 182 |
9 |
| Sila Nanotechnologies Inc. | 188 |
8 |
| Georgia Tech Research Corporation | 2943 |
7 |
| Lintec of America, Inc. | 159 |
6 |
| Panasonic Intellectual Property Management Co., Ltd. | 33997 |
4 |
| University of Washington | 2448 |
4 |
| NUtech Ventures | 365 |
3 |
| Oceanit Laboratories, Inc. | 79 |
3 |
| The University of Southern Mississippi | 91 |
3 |
| Generative Technology Operatives, LLC | 5 |
3 |
| Siemens AG | 24029 |
2 |
| The Regents of the University of California | 20745 |
2 |
| Applied Nanostructured Solutions, LLC | 94 |
2 |
| Weatherford Technology Holdings, LLC | 2155 |
2 |
| Lawrence Livermore National Security, LLC | 1973 |
2 |
| Northwestern University | 3543 |
2 |
| Intelli Particle Pty Ltd | 6 |
2 |
| Nexans | 642 |
2 |
| UChicago Argonne, LLC | 946 |
2 |
| Zeon Corporation | 4147 |
2 |
| Other owners | 91 |