- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
Patent holdings for IPC class H01B 1/24
Total number of patents in this class: 1508
10-year publication summary
|
112
|
120
|
130
|
84
|
74
|
85
|
78
|
84
|
52
|
46
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Zeon Corporation | 4183 |
30 |
| Borealis AG | 2734 |
21 |
| LG Chem, Ltd. | 17986 |
20 |
| Samsung Electronics Co., Ltd. | 159473 |
16 |
| Dow Global Technologies LLC | 11072 |
16 |
| National Institute of Advanced Industrial Science and Technology | 3791 |
13 |
| Nissan Chemical Corporation | 2307 |
13 |
| Panasonic Intellectual Property Management Co., Ltd. | 34623 |
12 |
| Denka Company Limited | 2778 |
12 |
| PPG Industries Ohio, Inc. | 3328 |
11 |
| Georgia Tech Research Corporation | 2996 |
11 |
| Kansai Paint Co., Ltd. | 644 |
11 |
| LG Energy Solution, Ltd. | 19725 |
11 |
| The Boeing Company | 20217 |
10 |
| Toray Industries, Inc. | 7161 |
10 |
| Battelle Memorial Institute | 2617 |
10 |
| Condalign AS | 26 |
10 |
| Mitsubishi Pencil Company, Limited | 834 |
10 |
| Showa Denko K.K. | 2050 |
9 |
| Northwestern University | 3586 |
9 |
| Other owners | 1243 |