- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 1/24 - Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon, or silicon
Patent holdings for IPC class H01B 1/24
Total number of patents in this class: 1469
10-year publication summary
137
|
112
|
120
|
130
|
84
|
74
|
85
|
75
|
80
|
29
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Zeon Corporation | 4077 |
30 |
LG Chem, Ltd. | 17632 |
21 |
Borealis AG | 2803 |
21 |
Samsung Electronics Co., Ltd. | 146092 |
16 |
Dow Global Technologies LLC | 10363 |
16 |
National Institute of Advanced Industrial Science and Technology | 3803 |
13 |
Nissan Chemical Corporation | 2010 |
13 |
Xerox Corporation | 7013 |
12 |
Georgia Tech Research Corporation | 2733 |
12 |
Northwestern University | 3389 |
12 |
Denka Company Limited | 2573 |
12 |
Panasonic Intellectual Property Management Co., Ltd. | 31375 |
11 |
The Boeing Company | 20043 |
10 |
Showa Denko K.K. | 2230 |
10 |
Toray Industries, Inc. | 6936 |
10 |
Condalign AS | 26 |
10 |
Kansai Paint Co., Ltd. | 664 |
10 |
LG Energy Solution, Ltd. | 14982 |
10 |
PPG Industries Ohio, Inc. | 3455 |
9 |
Battelle Memorial Institute | 2484 |
9 |
Other owners | 1202 |