- All sections
- H - Electricity
- H01B - Cablesconductorsinsulatorsselection of materials for their conductive, insulating or dielectric properties
- H01B 3/47 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes fibre-reinforced plastics, e.g. glass-reinforced plastics
Patent holdings for IPC class H01B 3/47
Total number of patents in this class: 61
10-year publication summary
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3
|
2
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2
|
2
|
4
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4
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5
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4
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4
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0
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| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Dow Global Technologies LLC | 10770 |
5 |
| ABB Technology AG | 1233 |
3 |
| Schlumberger Technology Corporation | 11483 |
2 |
| 3m Innovative Properties Company | 17512 |
2 |
| ABB Schweiz AG | 7441 |
2 |
| ABB Research Ltd. | 816 |
2 |
| BBY Solutions, Inc. | 392 |
2 |
| Seescan, Inc. | 548 |
2 |
| Shenzhen Wote Advanced Materials Co., Ltd. | 11 |
2 |
| TE Connectivity Solutions GmbH | 2964 |
2 |
| DuPont Safety & Construction, Inc. | 670 |
2 |
| Siemens Energy Global GmbH & Co. KG | 3249 |
2 |
| Hitachi Energy Ltd. | 2496 |
2 |
| Siemens AG | 24200 |
1 |
| Hitachi Metals, Ltd. | 1921 |
1 |
| Yazaki Corporation | 6963 |
1 |
| DSM IP Assets B.V. | 5429 |
1 |
| Rockwell Automation Technologies, Inc. | 2736 |
1 |
| Rohm and Haas Company | 2937 |
1 |
| Bond-laminates GmbH | 11 |
1 |
| Other owners | 24 |