- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/02 - HousingEnclosingEmbeddingFilling the housing or enclosure
Patent holdings for IPC class H01C 1/02
Total number of patents in this class: 132
10-year publication summary
|
10
|
11
|
15
|
10
|
11
|
7
|
9
|
9
|
15
|
8
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| KOA Corporation | 426 |
10 |
| Vishay Dale Electronics, LLC | 119 |
6 |
| Samsung Electro-mechanics Co., Ltd. | 6126 |
5 |
| Hubbell Incorporated | 3457 |
5 |
| Siemens Energy Global GmbH & Co. KG | 3432 |
5 |
| Murata Manufacturing Co., Ltd. | 25809 |
4 |
| Hamilton Sundstrand Corporation | 5014 |
4 |
| TDK Electronics AG | 1013 |
4 |
| Panasonic Intellectual Property Management Co., Ltd. | 34265 |
3 |
| NR Electric Co., Ltd. | 348 |
3 |
| NR Engineering Co., Ltd | 308 |
3 |
| NR Electric Power Electronics Co., Ltd. | 65 |
3 |
| Hitachi Energy Ltd. | 2610 |
3 |
| Ford Global Technologies, LLC | 21560 |
2 |
| Caterpillar Inc. | 10280 |
2 |
| Rohm Co., Ltd. | 6877 |
2 |
| Raycap, S.A. | 38 |
2 |
| Xiamen Set Electronics Co., Ltd | 84 |
2 |
| Eaton Intelligent Power Limited | 6268 |
2 |
| Niterra Co., Ltd. | 1415 |
2 |
| Other owners | 60 |