- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/02 - HousingEnclosingEmbeddingFilling the housing or enclosure
Patent holdings for IPC class H01C 1/02
Total number of patents in this class: 126
10-year publication summary
|
10
|
10
|
15
|
10
|
11
|
7
|
9
|
9
|
15
|
2
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| KOA Corporation | 422 |
10 |
| Vishay Dale Electronics, LLC | 117 |
6 |
| Samsung Electro-mechanics Co., Ltd. | 5756 |
5 |
| Hubbell Incorporated | 3360 |
5 |
| Siemens Energy Global GmbH & Co. KG | 3166 |
5 |
| Murata Manufacturing Co., Ltd. | 25252 |
4 |
| Hamilton Sundstrand Corporation | 5001 |
4 |
| Panasonic Intellectual Property Management Co., Ltd. | 32983 |
3 |
| NR Electric Co., Ltd. | 341 |
3 |
| NR Engineering Co., Ltd | 302 |
3 |
| NR Electric Power Electronics Co., Ltd. | 61 |
3 |
| TDK Electronics AG | 991 |
3 |
| Ford Global Technologies, LLC | 21095 |
2 |
| Caterpillar Inc. | 9998 |
2 |
| Rohm Co., Ltd. | 6678 |
2 |
| Raycap, S.A. | 38 |
2 |
| Xiamen Set Electronics Co., Ltd | 78 |
2 |
| Eaton Intelligent Power Limited | 6109 |
2 |
| Niterra Co., Ltd. | 1354 |
2 |
| Hitachi Energy Ltd. | 2405 |
2 |
| Other owners | 56 |