- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/024 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being hermetically sealed
Patent holdings for IPC class H01C 1/024
Total number of patents in this class: 30
10-year publication summary
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0
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1
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1
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1
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2
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2
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2
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2
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2
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3
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| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Smart Electronics Inc. | 37 |
3 |
| Ajou University Industry-academic Cooperation Foundation | 1186 |
2 |
| Pizzato Elettrica S.r.l. | 103 |
2 |
| Robert Bosch GmbH | 44254 |
1 |
| Bayerische Motoren Werke Aktiengesellschaft | 15373 |
1 |
| Arkema France | 4251 |
1 |
| China-epri Electric Power Engineering Co., Ltd | 34 |
1 |
| Dongguan Littelfuse Electronics Co., Ltd. | 52 |
1 |
| EBG Elektronische Bauelemente Ges.m.b.H. | 13 |
1 |
| Electric Power Research Institute, China Southern Power Grid | 271 |
1 |
| Hitachi Industrial Equipment Systems Co., Ltd. | 1551 |
1 |
| KOA Corporation | 426 |
1 |
| Sensata Technologies Massachusetts, Inc. | 10 |
1 |
| State Grid Corporation of China | 1404 |
1 |
| State Grid Smart Grid Research Institute | 62 |
1 |
| Viking Tech Corporation | 19 |
1 |
| Vishay MCB Industrie | 6 |
1 |
| Ohizumi Mfg. Co. Ltd | 8 |
1 |
| TDK Electronics AG | 1013 |
1 |
| Alps Alpine Co., Ltd. | 2321 |
1 |
| Other owners | 6 |