- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/026 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being hermetically sealed with gaseous or vacuum spacing between the resistive element and the housing or casing
Patent holdings for IPC class H01C 1/026
Total number of patents in this class: 13
10-year publication summary
|
1
|
1
|
1
|
0
|
0
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2
|
1
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1
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1
|
0
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| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Smart Electronics Inc. | 37 |
3 |
| Ajou University Industry-academic Cooperation Foundation | 977 |
2 |
| Meidensha Corporation | 856 |
2 |
| Mitsubishi Electric Corporation | 45068 |
1 |
| Elmatek Internation Corp. | 5 |
1 |
| Hitachi Industrial Equipment Systems Co., Ltd. | 1418 |
1 |
| State Grid Corporation of China | 1350 |
1 |
| Pinggao Group Co., Ltd. | 100 |
1 |
| Hitachi Energy Ltd. | 2250 |
1 |
| Other owners | 0 |