- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/028 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
Patent holdings for IPC class H01C 1/028
Total number of patents in this class: 85
10-year publication summary
|
6
|
7
|
11
|
10
|
6
|
5
|
7
|
4
|
4
|
5
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Rohm Co., Ltd. | 6411 |
8 |
| KOA Corporation | 415 |
7 |
| Murata Manufacturing Co., Ltd. | 24260 |
4 |
| Panasonic Intellectual Property Management Co., Ltd. | 30822 |
4 |
| TDK Electronics AG | 926 |
4 |
| Denso Corporation | 24069 |
3 |
| NR Electric Co., Ltd. | 322 |
3 |
| NR Engineering Co., Ltd | 284 |
3 |
| NR Electric Power Electronics Co., Ltd. | 53 |
3 |
| Robert Bosch GmbH | 42392 |
2 |
| Samsung Electro-mechanics Co., Ltd. | 5485 |
2 |
| Auxitrol S.A. | 27 |
2 |
| SEMITEC Corporation | 64 |
2 |
| Viking Tech Corporation | 15 |
2 |
| Vishay Electronic GmbH | 30 |
2 |
| Eaton Intelligent Power Limited | 5926 |
2 |
| Heraeus Nexensos GmbH | 46 |
2 |
| Pratt & Whitney Canada Corp. | 4518 |
1 |
| Texas Instruments Incorporated | 19473 |
1 |
| Texas Instruments Japan, Ltd. | 1656 |
1 |
| Other owners | 27 |