- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/034 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
Patent holdings for IPC class H01C 1/034
Total number of patents in this class: 54
10-year publication summary
|
6
|
3
|
4
|
9
|
7
|
6
|
2
|
3
|
9
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| KOA Corporation | 403 |
10 |
| Murata Manufacturing Co., Ltd. | 23827 |
7 |
| Rohm Co., Ltd. | 6385 |
4 |
| Panasonic Intellectual Property Management Co., Ltd. | 29944 |
3 |
| Littelfuse, Inc. | 774 |
3 |
| Amotech Co., Ltd. | 506 |
2 |
| Nippon Chemi-Con Corporation | 393 |
2 |
| United States of America AS represented by The Administrator of NASA | 411 |
2 |
| Vishay Dale Electronics, LLC | 109 |
2 |
| TDK Electronics AG | 899 |
2 |
| E. I. du Pont de Nemours and Company | 4247 |
1 |
| Texas Instruments Incorporated | 19444 |
1 |
| Denso Corporation | 23851 |
1 |
| Samsung Electro-mechanics Co., Ltd. | 5234 |
1 |
| Epcos AG | 730 |
1 |
| Continental Automotive GmbH | 5540 |
1 |
| Temic Automotive Electric Motors GmbH | 46 |
1 |
| Cyntec Co., Ltd. | 241 |
1 |
| Cree, Inc. | 1057 |
1 |
| Minco Products, Inc. | 14 |
1 |
| Other owners | 7 |