- All sections
- H - Electricity
- H01C - Resistors
- H01C 1/036 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath on wound resistive element
Patent holdings for IPC class H01C 1/036
Total number of patents in this class: 2
10-year publication summary
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0
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0
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1
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1
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0
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0
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0
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0
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0
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0
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| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Endress + Hauser Flowtec AG | 608 |
1 |
| Endress+Hauser Flowtec AG | 823 |
1 |
| Other owners | 0 |