- All sections
- H - Electricity
- H01C - Resistors
- H01C 17/07 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by resistor foil bonding, e.g. cladding
Patent holdings for IPC class H01C 17/07
Total number of patents in this class: 10
10-year publication summary
|
1
|
1
|
0
|
3
|
1
|
0
|
1
|
1
|
1
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Isabellenhütte Heusler GmbH & Co. KG. | 90 |
2 |
| Epcos AG | 727 |
1 |
| Conflux AB | 10 |
1 |
| KOA Corporation | 403 |
1 |
| Microchip Technology Incorporated | 2732 |
1 |
| Ralec Electronic Corporation | 6 |
1 |
| Tomoegawa Co., Ltd. | 248 |
1 |
| Wieland-Werke AG | 326 |
1 |
| TDK Electronics AG | 904 |
1 |
| Other owners | 0 |