- All sections
- H - Electricity
- H01C - Resistors
- H01C 17/12 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin-film techniques by sputtering
Patent holdings for IPC class H01C 17/12
Total number of patents in this class: 61
10-year publication summary
8
|
3
|
5
|
4
|
2
|
4
|
2
|
5
|
3
|
2
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Mitsubishi Materials Corporation | 2442 |
22 |
International Business Machines Corporation | 61210 |
3 |
Renesas Electronics Corporation | 6014 |
3 |
Panasonic Intellectual Property Management Co., Ltd. | 31330 |
3 |
JX Nippon Mining & Metals Corporation | 1489 |
3 |
KOA Corporation | 418 |
3 |
Samsung Electro-mechanics Co., Ltd. | 5612 |
2 |
3D Glass Solutions, Inc. | 81 |
2 |
TDK Electronics AG | 933 |
2 |
Kyocera Corporation | 13800 |
1 |
Rohm Co., Ltd. | 6444 |
1 |
Analog Devices, Inc. | 3375 |
1 |
Korea Institute of Science and Technology | 2115 |
1 |
Gottfried Wilhelm Leibniz Universität Hannover | 152 |
1 |
Microchip Technology Incorporated | 2860 |
1 |
Nanjing Sart Science & Technology Development Co., Ltd. | 22 |
1 |
National Pingtung University of Science & Technology | 30 |
1 |
Siegert Thinfilm Technology GmbH | 4 |
1 |
State of Oregon acting by and through the State Board of Higher Education on behalf of Oregon State University | 90 |
1 |
Taiyo Yuden Co., Ltd. | 1935 |
1 |
Other owners | 7 |