- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/449 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups involving the application of mechanical vibrations, e.g. ultrasonic vibrations
Patent holdings for IPC class H01L 21/449
Total number of patents in this class: 15
10-year publication summary
1
|
1
|
0
|
2
|
0
|
1
|
2
|
0
|
3
|
0
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Boe Technology Group Co., Ltd. | 41217 |
2 |
Crest Ultrasonics Corp. | 10 |
2 |
Mikro Mesa Technology Co., Ltd. | 106 |
2 |
Samsung Electronics Co., Ltd. | 146346 |
1 |
National Semiconductor Corporation | 1073 |
1 |
Rohm Co., Ltd. | 6459 |
1 |
Sandisk Technologies Inc. | 4809 |
1 |
Gachon University of Industry-academic Cooperation Foundation | 298 |
1 |
Newsouth Innovations Pty Limited | 592 |
1 |
Ordos Yuansheng Optoelectronics Co., Ltd. | 1275 |
1 |
Kulicke and Soffa Industries, Inc. | 303 |
1 |
Beijing BOE Technology Development Co., Ltd. | 2866 |
1 |
Other owners | 0 |