- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 35/08 - Structural details of the junction; Connections of leads non-detachable, e.g. cemented, sintered, soldered
Patent holdings for IPC class H01L 35/08
Total number of patents in this class: 272
10-year publication summary
|
34
|
41
|
46
|
42
|
32
|
15
|
3
|
1
|
0
|
0
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Panasonic Intellectual Property Management Co., Ltd. | 33033 |
17 |
| Kelk Ltd. | 157 |
17 |
| Mitsubishi Materials Corporation | 2466 |
16 |
| Valeo Systemes Thermiques | 2796 |
12 |
| Lintec Corporation | 1991 |
10 |
| LG Chem, Ltd. | 17745 |
7 |
| LG Innotek Co., Ltd. | 8062 |
7 |
| Hyundai Motor Company | 23273 |
6 |
| Sumitomo Chemical Company, Limited | 9051 |
6 |
| Kia Motors Corporation | 7738 |
6 |
| BASF SE | 21146 |
5 |
| Hitachi Chemical Company, Ltd. | 2294 |
5 |
| FUJIFILM Corporation | 30063 |
5 |
| Sheetak, Inc. | 49 |
5 |
| Denso Corporation | 24997 |
4 |
| Industrial Technology Research Institute | 5067 |
4 |
| MAHLE International GmbH | 2857 |
4 |
| Furukawa Co., Ltd. | 95 |
4 |
| Sumitomo Electric Industries, Ltd. | 15978 |
3 |
| Hitachi, Ltd. | 15819 |
3 |
| Other owners | 126 |