- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 35/22 - Selection of the material for the legs of the junction using inorganic compositions comprising compounds containing boron, carbon, oxygen, or nitrogen
Patent holdings for IPC class H01L 35/22
Total number of patents in this class: 453
10-year publication summary
|
56
|
53
|
66
|
62
|
37
|
23
|
28
|
4
|
0
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| FUJIFILM Corporation | 29329 |
44 |
| Murata Manufacturing Co., Ltd. | 24478 |
20 |
| Zeon Corporation | 4080 |
14 |
| Sumitomo Chemical Company, Limited | 9046 |
12 |
| Fujitsu Limited | 18341 |
10 |
| National University Corporation Nara Institute of Science and Technology | 237 |
10 |
| Hitachi, Ltd. | 15467 |
9 |
| Mitsubishi Materials Corporation | 2438 |
9 |
| Samsung Electronics Co., Ltd. | 145630 |
8 |
| Sumitomo Electric Industries, Ltd. | 15443 |
8 |
| Hyundai Motor Company | 21938 |
7 |
| Panasonic Intellectual Property Management Co., Ltd. | 31273 |
7 |
| LG Innotek Co., Ltd. | 7624 |
7 |
| Kia Motors Corporation | 7757 |
7 |
| Consorzio Delta Ti Research | 13 |
6 |
| Universal Entertainment Corporation | 553 |
6 |
| Termo-ind S.A. | 13 |
6 |
| Panasonic Corporation | 20128 |
5 |
| Japan Science and Technology Agency | 1325 |
5 |
| Hitachi Metals, Ltd. | 1983 |
4 |
| Other owners | 249 |