- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 12/77 - Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
Patent holdings for IPC class H01R 12/77
Total number of patents in this class: 1110
10-year publication summary
|
80
|
93
|
80
|
87
|
95
|
78
|
65
|
83
|
92
|
59
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Yazaki Corporation | 7072 |
56 |
| Japan Aviation Electronics Industry, Limited | 1849 |
51 |
| Sumitomo Electric Industries, Ltd. | 16273 |
49 |
| Sumitomo Wiring Systems, Ltd. | 10954 |
38 |
| Samsung Electronics Co., Ltd. | 157039 |
37 |
| AutoNetworks Technologies, Ltd. | 7059 |
36 |
| Molex, LLC | 2053 |
24 |
| Foxconn Interconnect Technology Limited | 1170 |
21 |
| TE Connectivity Solutions GmbH | 3042 |
21 |
| Panasonic Intellectual Property Management Co., Ltd. | 33792 |
20 |
| 3m Innovative Properties Company | 17497 |
18 |
| Fujikura Ltd. | 3067 |
16 |
| Apple Inc. | 58592 |
15 |
| Intel Corporation | 47048 |
15 |
| Kyocera Corporation | 14318 |
15 |
| Hirose Electric Co., Ltd. | 390 |
15 |
| DDK Ltd. | 29 |
14 |
| P-Two Industries Inc. | 56 |
13 |
| Aptiv Technologies AG | 2412 |
13 |
| Dai-Ichi Seiko Co., Ltd. | 257 |
12 |
| Other owners | 611 |