- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 13/405 - Securing in non-demountable manner, e.g. moulding, riveting
Patent holdings for IPC class H01R 13/405
Total number of patents in this class: 1383
10-year publication summary
|
92
|
122
|
157
|
154
|
117
|
95
|
113
|
109
|
94
|
58
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 1104 |
149 |
| Sumitomo Wiring Systems, Ltd. | 10422 |
103 |
| Yazaki Corporation | 6719 |
74 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 332 |
56 |
| Japan Aviation Electronics Industry, Limited | 1728 |
47 |
| Sumitomo Electric Industries, Ltd. | 15576 |
33 |
| AutoNetworks Technologies, Ltd. | 6635 |
31 |
| Hirose Electric Co., Ltd. | 364 |
30 |
| Advanced Connectek Inc. | 342 |
29 |
| Molex, LLC | 1955 |
27 |
| Robert Bosch GmbH | 42784 |
25 |
| Lotes Co., Ltd. | 351 |
23 |
| TE Connectivity Solutions GmbH | 2830 |
19 |
| Cheng Uei Precision Industry Co., Ltd. | 477 |
18 |
| Apple Inc. | 55345 |
17 |
| Dongguan Luxshare Technologies Co., Ltd. | 282 |
14 |
| Amphenol Corporation | 755 |
12 |
| Guangdong Oppo Mobile Telecommunications Corp., Ltd. | 21157 |
10 |
| Tyco Electronics (shanghai) Co. Ltd. | 897 |
9 |
| Hosiden Corporation | 383 |
9 |
| Other owners | 648 |