- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 13/504 - BasesCases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
Patent holdings for IPC class H01R 13/504
Total number of patents in this class: 687
10-year publication summary
|
33
|
52
|
64
|
87
|
54
|
80
|
57
|
40
|
37
|
21
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 1099 |
56 |
| Sumitomo Wiring Systems, Ltd. | 10376 |
43 |
| Yazaki Corporation | 6700 |
30 |
| Molex, LLC | 1944 |
29 |
| Dongguan Luxshare Technologies Co., Ltd. | 277 |
25 |
| Sumitomo Electric Industries, Ltd. | 15511 |
24 |
| AutoNetworks Technologies, Ltd. | 6602 |
24 |
| Apple Inc. | 55017 |
20 |
| Robert Bosch GmbH | 42677 |
17 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 326 |
16 |
| TE Connectivity Solutions GmbH | 2810 |
13 |
| Japan Aviation Electronics Industry, Limited | 1713 |
12 |
| Phoenix Contact GmbH & Co. KG | 2288 |
12 |
| Medtronic, Inc. | 9815 |
8 |
| Tyco Electronics (shanghai) Co. Ltd. | 894 |
8 |
| Advanced Connectek Inc. | 342 |
8 |
| Guangdong Oppo Mobile Telecommunications Corp., Ltd. | 21070 |
8 |
| Hirose Electric Co., Ltd. | 363 |
6 |
| TE Connectivity Germany GmbH | 650 |
6 |
| TE Connectivity Japan G.K. | 239 |
6 |
| Other owners | 316 |