- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 13/504 - BasesCases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
Patent holdings for IPC class H01R 13/504
Total number of patents in this class: 767
10-year publication summary
|
52
|
64
|
87
|
54
|
80
|
57
|
43
|
42
|
30
|
54
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Foxconn Interconnect Technology Limited | 1186 |
63 |
| Sumitomo Wiring Systems, Ltd. | 11157 |
52 |
| Molex, LLC | 2078 |
36 |
| Dongguan Luxshare Technologies Co., Ltd. | 383 |
32 |
| Yazaki Corporation | 7142 |
31 |
| Sumitomo Electric Industries, Ltd. | 16345 |
28 |
| AutoNetworks Technologies, Ltd. | 7225 |
28 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 395 |
22 |
| Apple Inc. | 59177 |
19 |
| Robert Bosch GmbH | 44291 |
17 |
| Japan Aviation Electronics Industry, Limited | 1864 |
14 |
| TE Connectivity Solutions GmbH | 3067 |
13 |
| Phoenix Contact GmbH & Co. KG | 2295 |
12 |
| Tyco Electronics (shanghai) Co. Ltd. | 1073 |
9 |
| Medtronic, Inc. | 9800 |
8 |
| Advanced Connectek Inc. | 357 |
8 |
| Guangdong Oppo Mobile Telecommunications Corp., Ltd. | 23560 |
8 |
| Hirose Electric Co., Ltd. | 396 |
6 |
| Hosiden Corporation | 390 |
6 |
| TE Connectivity Germany GmbH | 609 |
6 |
| Other owners | 349 |