- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 13/6596 - Specific features or arrangements of connection of shield to conductive members the conductive member being a metal grounding panel
Patent holdings for IPC class H01R 13/6596
Total number of patents in this class: 267
10-year publication summary
|
27
|
30
|
27
|
23
|
23
|
8
|
15
|
15
|
12
|
10
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Yazaki Corporation | 7137 |
26 |
| Foxconn Interconnect Technology Limited | 1184 |
22 |
| TE Connectivity Solutions GmbH | 3065 |
16 |
| Advanced Connectek Inc. | 357 |
11 |
| Foxconn (Kunshan) Computer Connector Co., Ltd. | 394 |
9 |
| Sumitomo Wiring Systems, Ltd. | 11139 |
8 |
| J.S.T. Corporation | 184 |
7 |
| Molex, LLC | 2077 |
7 |
| Hosiden Corporation | 389 |
6 |
| Japan Aviation Electronics Industry, Limited | 1865 |
6 |
| Hon Hai Precision Industry Co., Ltd. | 4013 |
5 |
| Lotes Co., Ltd. | 357 |
5 |
| Dongguan Luxshare Technologies Co., Ltd. | 379 |
5 |
| Aptiv Technologies AG | 2320 |
5 |
| Robert Bosch GmbH | 44252 |
4 |
| Tyco Electronics (shanghai) Co. Ltd. | 1073 |
4 |
| Hubbell Incorporated | 3456 |
4 |
| FCI USA LLC | 240 |
4 |
| Apple Inc. | 59117 |
3 |
| Microsoft Technology Licensing, LLC | 54524 |
3 |
| Other owners | 107 |