- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/74 - Means for mounting coupling parts to apparatus or structures, e.g. to a wall for mounting coupling parts in openings of a panel
Patent holdings for IPC class H01R 13/74
Total number of patents in this class: 1159
10-year publication summary
|
105
|
84
|
116
|
106
|
107
|
112
|
76
|
62
|
77
|
4
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Yazaki Corporation | 6457 |
107 |
| Sumitomo Wiring Systems, Ltd. | 9995 |
104 |
| Phoenix Contact GmbH & Co. KG | 2249 |
27 |
| TE Connectivity Solutions GmbH | 2777 |
26 |
| Sumitomo Electric Industries, Ltd. | 14929 |
23 |
| AutoNetworks Technologies, Ltd. | 6309 |
23 |
| Tyco Electronics (shanghai) Co. Ltd. | 830 |
16 |
| HARTING Electric GmbH & Co. KG | 430 |
16 |
| Japan Aviation Electronics Industry, Limited | 1668 |
16 |
| Apple Inc. | 52607 |
15 |
| Tyco Electronics Corporation | 782 |
13 |
| Hubbell Incorporated | 3162 |
13 |
| Foxconn Interconnect Technology Limited | 1068 |
12 |
| Titan3 Technology LLC | 182 |
12 |
| Robert Bosch GmbH | 41717 |
11 |
| Molex, LLC | 1858 |
11 |
| CommScope Technologies LLC | 3460 |
9 |
| Samsung Electronics Co., Ltd. | 138518 |
8 |
| Microsoft Technology Licensing, LLC | 52891 |
8 |
| Arlington Industries, Inc. | 227 |
8 |
| Other owners | 681 |