- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 24/00 - Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
Patent holdings for IPC class H01R 24/00
Total number of patents in this class: 1567
10-year publication summary
|
138
|
104
|
78
|
66
|
63
|
61
|
66
|
64
|
38
|
25
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Hon Hai Precision Industry Co., Ltd. | 4021 |
81 |
| Foxconn Interconnect Technology Limited | 1191 |
79 |
| Molex, LLC | 2083 |
44 |
| Japan Aviation Electronics Industry, Limited | 1872 |
38 |
| Advanced Connectek Inc. | 358 |
36 |
| TE Connectivity Solutions GmbH | 3077 |
36 |
| Panduit Corp. | 1016 |
32 |
| Sumitomo Wiring Systems, Ltd. | 11204 |
31 |
| CommScope Technologies LLC | 3251 |
26 |
| Lotes Co., Ltd. | 357 |
22 |
| Yazaki Corporation | 7161 |
21 |
| CommScope North Carolina, LLC. | 318 |
21 |
| Huawei Technologies Co., Ltd. | 125107 |
20 |
| Sumitomo Electric Industries, Ltd. | 16404 |
18 |
| AutoNetworks Technologies, Ltd. | 7268 |
18 |
| Molex Incorporated | 416 |
17 |
| Apple Inc. | 59354 |
16 |
| Belden Canada ULC | 231 |
16 |
| Tyco Electronics Japan G.K. | 159 |
13 |
| CommScope EMEA Limited | 274 |
13 |
| Other owners | 969 |