- All sections
- H - Electricity
- H01R - Electrically-conductive connectionsstructural associations of a plurality of mutually-insulated electrical connecting elementscoupling devicescurrent collectors
- H01R 43/24 - Assembling by moulding on contact members
Patent holdings for IPC class H01R 43/24
Total number of patents in this class: 833
10-year publication summary
54
|
65
|
80
|
83
|
64
|
79
|
51
|
47
|
31
|
18
|
2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Foxconn Interconnect Technology Limited | 1105 |
60 |
Sumitomo Wiring Systems, Ltd. | 10444 |
59 |
Yazaki Corporation | 6726 |
54 |
Amphenol Corporation | 757 |
31 |
Sumitomo Electric Industries, Ltd. | 15593 |
29 |
AutoNetworks Technologies, Ltd. | 6648 |
29 |
Dongguan Luxshare Technologies Co., Ltd. | 282 |
25 |
Foxconn (Kunshan) Computer Connector Co., Ltd. | 333 |
22 |
Robert Bosch GmbH | 42813 |
21 |
Hirose Electric Co., Ltd. | 364 |
17 |
Japan Aviation Electronics Industry, Limited | 1732 |
17 |
Apple Inc. | 55387 |
15 |
Molex, LLC | 1957 |
12 |
Phoenix Contact GmbH & Co. KG | 2288 |
9 |
TE Connectivity Solutions GmbH | 2844 |
9 |
TE Connectivity Germany GmbH | 648 |
8 |
Lotes Co., Ltd. | 351 |
7 |
Vicor Corporation | 125 |
7 |
Aptiv Technologies AG | 2373 |
6 |
Hon Hai Precision Industry Co., Ltd. | 4030 |
5 |
Other owners | 391 |