- All sections
- H - Electricity
- H04B - Transmission
- H04B 1/7077 - Multi-step acquisition, e.g. multi-dwell, coarse-fine or validation
Patent holdings for IPC class H04B 1/7077
Total number of patents in this class: 16
10-year publication summary
|
1
|
1
|
0
|
2
|
2
|
0
|
1
|
0
|
1
|
0
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Qualcomm Incorporated | 84335 |
3 |
| Microchip Technology Incorporated | 2834 |
2 |
| Deere & Company | 7495 |
1 |
| Hitachi Kokusai Electric Inc. | 882 |
1 |
| Mitsubishi Electric Corporation | 45752 |
1 |
| Commissariat à l'énergie atomique et aux energies alternatives | 10818 |
1 |
| Korea Advanced Institute of Science and Technology | 4323 |
1 |
| Cambridge Silicon Radio Limited | 101 |
1 |
| General Dynamics Mission Systems, Inc. | 127 |
1 |
| United States Government, as represented by the Secretary of the Navy | 15 |
1 |
| Harris Global Communications, Inc. | 353 |
1 |
| Brother Kogyo Kabushikikaisha | 1751 |
1 |
| Dutch Innovation B.V. | 2 |
1 |
| Other owners | 0 |