- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
Patent holdings for IPC class H05K 3/04
Total number of patents in this class: 307
10-year publication summary
|
31
|
20
|
19
|
19
|
34
|
40
|
18
|
18
|
22
|
1
|
| 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| GENTHERM GmbH | 256 |
10 |
| Nederlandse Organisatie voor Toegepast-natuurwetenschappelijk Onderzoek TNO | 2378 |
8 |
| 3m Innovative Properties Company | 17957 |
6 |
| Robert Bosch GmbH | 41786 |
6 |
| Huawei Technologies Co., Ltd. | 106762 |
5 |
| Raytheon Company | 8444 |
5 |
| Board of Regents, The University of Texas System | 5619 |
5 |
| DP Patterning AB | 5 |
5 |
| Xerox Corporation | 7076 |
4 |
| E. I. du Pont de Nemours and Company | 4249 |
4 |
| Intel Corporation | 46126 |
4 |
| LG Innotek Co., Ltd. | 7242 |
4 |
| Avery Dennison Corporation | 1229 |
4 |
| Radial Electronics, Inc. | 10 |
4 |
| Richview Electronics Co., Ltd. | 20 |
4 |
| Manaflex, LLC | 14 |
4 |
| Shinko Electric Industries Co., Ltd. | 1185 |
3 |
| Amphenol Corporation | 738 |
3 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 458 |
3 |
| Avery Dennison Retail Information Services LLC | 1121 |
3 |
| Other owners | 213 |