- All sections
- H - Electricity
- H05K - Printed circuitscasings or constructional details of electric apparatusmanufacture of assemblages of electrical components
- H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
Patent holdings for IPC class H05K 3/14
Total number of patents in this class: 249
10-year publication summary
|
26
|
25
|
24
|
17
|
12
|
17
|
18
|
18
|
12
|
10
|
| 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 | 2025 | 2026 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Samsung Display Co., Ltd. | 37933 |
5 |
| The Boeing Company | 20094 |
5 |
| Ibiden Co., Ltd. | 1667 |
5 |
| Johnson & Johnson Vision Care, Inc. | 1178 |
4 |
| Sony Corporation | 30388 |
4 |
| Denka Company Limited | 2702 |
4 |
| Samsung Electronics Co., Ltd. | 154120 |
3 |
| International Business Machines Corporation | 62251 |
3 |
| Massachusetts Institute of Technology | 10201 |
3 |
| Dai Nippon Printing Co., Ltd. | 4216 |
3 |
| St. Jude Medical, Cardiology Division, Inc. | 1630 |
3 |
| Orbotech Ltd. | 255 |
3 |
| Tactotek Oy | 163 |
3 |
| Plasma Innovations GmbH | 20 |
3 |
| Dujud LLC | 3 |
3 |
| Apple Inc. | 58122 |
2 |
| Siemens AG | 24199 |
2 |
| LG Chem, Ltd. | 17840 |
2 |
| Hewlett-Packard Development Company, L.P. | 25342 |
2 |
| Intel Corporation | 46681 |
2 |
| Other owners | 185 |